封装尺寸 (mm):
绝对最大额定值 @ Ta=25°C
| Parameter | Symbol | Maximum Rating | Unit |
|---|---|---|---|
| Power Dissipation | Pd | 325 | mW |
| Max Pulse Current | IFP | 60 | mA |
| DC Forward Current | IF | 50 | mA |
| Reverse Voltage | VR | 5 | V |
| Electrostatic Discharge Threshold ( HBM) | ESD | 6000 | V |
| Operating Temperature | Topr | -40 to 60℃ | ℃ |
| Storage Temperature | Tstg | -40 to 85℃ | ℃ |
| Soldering Temperature | Tsol | Reflow Soldering: 260℃/10S --- Manual Soldering: 320℃/3S | ℃ |
电气光学特性 @ Ta=25°C
| Parameter | Symbol | Color | Min. | Typ. | Max. | Unit | Test Condition |
|---|---|---|---|---|---|---|---|
| Forward Voltage | VF | UVB | 5 | 6 | 7 | V | IF=40mA |
| Radiant Power | Po | UVB | 5 | 8 | 10 | mW | IF=40mA |
| Peak Wavelength | λp | UVB | 285 | 290 | 295 | nm | IF=40mA |
| Reverse Current | IR | UVB | 3 | μA | VR=5V | ||
| Half Power View | 2θ1/2 | UVB | 120 | deg | IF=40mA |
