封装尺寸 (mm):
绝对最大额定值 @ Ta=25°C
| Parameter | Symbol | Maximum Rating | Unit |
|---|---|---|---|
| Continous Forward Current | IF | 40 | mA |
| Peak Forward Current (1/10 Duty Cycle, 0.1ms Pulse Width) | IFp | 60 | mA |
| Reverse Voltage | VR | 5 | V |
| Electrical Power | PD | 0.2 | W |
| Electrostatic Discharge Threshold ( HBM) | ESD | 6000 | V |
| Operating Temperature | TOPR | -40°C to +60°C | |
| Storage Temperature | TSTG | -40°C to +85°C | |
| Lead Soldering Temperature | TSOL | Reflow Soldering: 260°C for 10 seconds | |
| LED Solder Temperature | TS | 80°C | |
电气光学特性 @ Ta=25°C
| Parameter | Symbol | Color | Min. | Typ. | Max. | Unit | Test Condition |
|---|---|---|---|---|---|---|---|
| Forward Voltage | VF | UVC | 5.5 | 6 | 7 | V | IF=40mA |
| Radiant Power | Po | UVC | 5 | 10 | mW | IF=40mA | |
| Peak Wavelength | λp | UVC | 260 | 265 | 270 | nm | IF=40mA |
| Reverse Current | IR | UVC | 3 | μA | VR=5V | ||
| Viewing Angle | 2θ1/2 | UVC | 120 | deg | IF=40mA |
