封装尺寸 (mm):
绝对最大额定值 @ Ta=25°C
| Parameter | Symbol | Maximum Rating | Unit |
|---|---|---|---|
| Continous Forward Current | IF | 700 | mA |
| Peak Foward Current (1/10 Duty Cycle, 0.1ms Plus Width) | IFp | 1000 | mA |
| Reverse Voltage | VR | 5 | V |
| Power Dissipation | PD | 3 | W |
| Electrostatic Discharge | ESD | 1000 | V |
| Operating Temperature | TOPR | -25°C to +85°C | °C |
| Storage Temperature | TSTG | -35°C to +105°C | °C |
| Lead Soldering Temperature | TSOL | 360°C | °C |
电气光学特性 @ Ta=25°C
| Parameter | Symbol | Min. | Typ. | Max. | Unit | Test Condition |
|---|---|---|---|---|---|---|
| Forward Voltage | VF | 5.5 | 6.5 | V | IF=700mA | |
| Reverse Current | IR | 10 | μA | VR=40V | ||
| Viewing Angle | 2θ1/2 | 120 | deg | IF=700mA | ||
| Color Rendering Index | Ra | 70 | IF=700mA | |||
| Luminous Flux | Φ | 600 | 800 | lm | IF=700mA | |
| Color Temperature | Tc | 5000 | 6000 | K | IF=700mA |
